Category Capability Details Board Size Min（pcs） 1*0.5mm Max (Pnl Size) 250*1200mm Base Material Thickness 0.06——0.3mm Board Thickness 0.1-0.5mm Base Copper Thickness 1/3OZ——2OZ PTH Hole Wall Copper Thickness 8-20μm Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth) 01:10:00 Blind Hole Filling Capacity (Hole Size) 50-150μm Single Line Impedance Tolerance ±10% Differential Impedance Tolerance ±10% Min Track/Spacing (Double Layers Board) Surface Copper Thickness：8-14μm 40/40 um Surface Copper Thickness：15-20μm 45/45 um Surface Copper Thickness：21-30μm 55/55 um Surface Copper Thickness：31-40μm 75/75 um Surface Copper Thickness：≥40μm 80/80 um Line Width Tolerance Line Width≤0.050mm ±.02mm 0.05mm＜Line Width≤0.15mm ±20% Line Width＞0.150mm ±10% Silkscreen Silkscreen Character Min Width/Spacing 4mil Impedance Green Solder Mask Thickness Range 10~30 μm Related Capacity Dimension Tolerance from Line Edge to Plate Edge ±0.25 mm

Category Capability Details Width Tolerance of White Line Smooth Place ±0.10 mm Bump Place ±0.20 mm Min Drilling Hole Size Machine Dril 0.100 mm Min Punching Hole Size N/A 0.50 mm Complete Hole Size Tolerances PTH ±0.050 mm NPTH ±0.025 mm

Category Capability Details Nickel Gold Plating Nickel Thickness 40~ 314U” Nickel Th ±78U” Gold Thickness 1.18U” ~ 40U” Min Spacing (Golden Finger or Pad) 35um Nickel Gold Immersion Nickel Thickness 40 ~ 236 U” Nickel Th ±40U” Gold Thickness 1U” ~ 3 U” Min Spacing (Golden Finger or Pad) 40um OSP OSP Thicknes 6U”~20U”

Category	Capability	Details
Board Size	Min（pcs）	1*0.5mm
Board Size	Max (Pnl Size)	250*1200mm
Base Material Thickness		0.06——0.3mm
Board Thickness		0.1-0.5mm
Base Copper Thickness		1/3OZ——2OZ
PTH Hole Wall Copper Thickness		8-20μm
Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth)		01:10:00
Blind Hole Filling Capacity (Hole Size)		50-150μm
Single Line Impedance Tolerance		±10%
Differential Impedance Tolerance		±10%
Min Track/Spacing (Double Layers Board)	Surface Copper Thickness：8-14μm	40/40 um
	Surface Copper Thickness：15-20μm	45/45 um
	Surface Copper Thickness：21-30μm	55/55 um
	Surface Copper Thickness：31-40μm	75/75 um
	Surface Copper Thickness：≥40μm	80/80 um
Line Width Tolerance	Line Width≤0.050mm	±.02mm
	0.05mm＜Line Width≤0.15mm	±20%
	Line Width＞0.150mm	±10%
Silkscreen	Silkscreen Character Min Width/Spacing	4mil
Impedance	Green Solder Mask Thickness Range	10~30 μm
Related Capacity	Dimension Tolerance from Line Edge to Plate Edge	±0.25 mm

Drilling & Hole

Category	Capability	Details
Width Tolerance of White Line	Smooth Place	±0.10 mm
Width Tolerance of White Line	Bump Place	±0.20 mm
Min Drilling Hole Size	Machine Dril	0.100 mm
Min Punching Hole Size	N/A	0.50 mm
Complete Hole Size Tolerances	PTH	±0.050 mm
Complete Hole Size Tolerances	NPTH	±0.025 mm

Surface Treatment

Category	Capability	Details
Nickel Gold Plating	Nickel Thickness	40~ 314U”
	Nickel Th	±78U”
	Gold Thickness	1.18U” ~ 40U”
	Min Spacing (Golden Finger or Pad)	35um
Nickel Gold Immersion	Nickel Thickness	40 ~ 236 U”
	Nickel Th	±40U”
	Gold Thickness	1U” ~ 3 U”
	Min Spacing (Golden Finger or Pad)	40um
OSP	OSP Thicknes	6U”~20U”