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PCB Terms And Abbreviations
To simplify communication in the PCB industry, many technical terms and abbreviations have been defined by the international industry. For faster and smoother communication with you, JHDPCB hereby provides a list of technical terms and abbreviations and their explanations.
Terms and Abbreviations
| Definition | Short Description |
| BARE BOARD TESTING | Electrical Testing of the non-populated PCB. |
| BLIND and BURIED VIA HOLES | A Blind Via connects an Outer Layer to one or more Inner Layers but does not go through the entire board. A Buried Via connects two or more Inner Layers but does not go through to an Outer Layer. |
| BOARD PRICE | The price includes the price for the PCB’s selected in the calculator |
| BOARD SURFACE | The board surface area expressed in dm². |
| BOARD THICKNESS | The thickness given in mm based on the base materials used including copper foil. |
| BOTTOM | Bottom side of the PCB. |
| BUILDUP | Defined build of a PCB such as number of layers an their sequence. |
| CARBON CONTACTS | Carbon Ink normally used for keyboard contacts, LCD contacts and jumpers. |
| CHAMFERED MECHANICAL or COUNTERSUNK HOLES | A beveled edge of a holes usually at 45 degrees. |
| COPPER FOIL | Copper Foils is the base copper thickness applied on OUTER and INNER layers. |
| Che Ni/Au or ENIG (Electroless Nickel Immersion Gold) | ENIG, Electro less Nickel Immersion Gold, also called Che Ni/Au, chemical nickel gold or also known as soft gold. |
| CORE | A rigid base material laminate with copper on one or two sides. |
| COPPER UP TO THE BOARD EDGE | Copper is placed up to the very edge of the Board Contour. |
| Cu | Cu is the chemical abbreviation for Copper |
| DELIVERY TERM | Number of days required to manufacture. |
| DELIVERY FORMAT | The method in which you ask Eurocircuits to produce and delivery your PCB design. |
| eC REGISTRATION COMPATIBLE | PCB’s or Customer Panels that have the necessary Tooling Holes to be used with the Eurocircuits eC-stencil-mate or eC-stencil-fix equipment. |
| DEPTH ROUTING | Removing a specific area of the Outer Layer of the PCB to a specific depth. |
| EDGE CONNECTOR BEVELING | Reduce the square edge of the connector to a sloping edge to ease entry in to the socket. |
| EDGE CONNECTOR GOLD SURFACE | A layer of gold plated to the fingers of the Edge Connector. |
| EXTRA PRESS CYCLES | When producing Multi-layers with Blind and Buried Via Holes, additional Press Cycles may be required. |
| FIDUCIAL | An Optical target. |
| EXTRA PTH RUN | When producing multilayers with Blind and Buried Via Holes, the panel may need to pass through the galvanic Plating process multiple times. |
| FINISHED HOLE SIZE | The finished hole size or ENDHOLE is the diameter that the PCB designer specifies in his PCB layout. |
| GROSS PRICE | The price including VAT |
| FR4 | Fiberglass reinforced epoxy laminates that are Flame Retardant. |
| HAL | Hot Air Leveling Lead Free Tin (Sn) |
| HOLE DENSITY | The number of holes per dm² of the board surface. |
| HEATSINK PASTE | A paste used too fill Via Holes that are designed for Thermal dissipation. |
| IAR | Inner Layer Annular Ring |
| IPI | Inner Layer Pad Insulation |
| INNER | The Inner Layer(s) of the PCB. |
| LAYER | Individual layer of a PCB. |
| LEAKAGE | A type of short, sometimes referred to as a high-resistance short. |
| LEAD FREE FINISH | Final finish applied to the soldering areas of the PCB to prevent oxidation and to them easier to solder. |
| LEGEND | Text printed on top of the Soldermask. |
| MICRO SECTION of a PTH | A cross section of a PTH Hole. |
| NET PRICE | The price excluding Taxes or VAT. |
| MILLING | Used to form the contour of the PCB’s or Panels. |
| OAR | Outer Layer Annular Ring |
| ORDER SURFACE | The total delivered PCB surface area of your order expressed in dm². |
| OPEN | A discontinuity or non-connection within a net . |
| OUTER | The Outer Layer(s) of the PCB either the TOP or BOTTOM side. |
| PANEL CROSS OUTS | A Panel where defective PCB’s have been visually crossed out. |
| PANEL BORDER | Extra material around your PCB or multiple PCB’s to form a Customer Panel. |
| PANEL OUTLINE | The required contour of a Customer Panel. |
| PCB | Printed Circuit Board (also know as “the board”). |
| PANEL SPACING | The PCB Spacing defines the extra space you want between different PCB’s on the Customer Panel. |
| PEEL-ABLE MASK | Also know as Peel-off Mask is a protective coating that can be easily removed. |
| PCB SEPARATION METHOD | Pre-cut the boards in a Customer Panel for easy removal after assembly. |
| PHD or TOOLSIZE | The diameter of the Tool used in production to drill the hole. |
| PLATING INDEX | The density of the Copper distribution. |
| PLATED HOLES ON THE BOARD EDGE | Plated through holes in the edge of the board. |
| PREPREG | An unpressed base material without any copper foil. |
| PP | The Pad to Pad spacing specified in mm |
| PRESS-FIT HOLES | Holes designed for the press fit of component leads, usually connectors. |
| ROUND EDGE PLATING | The edge of the board is plated with copper and then the final finish such as HAL. |
| SHIPMENT DATE | The date on which the order is shipped. |
| SHORT | An electrical connection between two or more nets or isolated points that should not be connected. |
| SMD or Surface Mount Device | Surface mounted Device. |
| SINGLE PCB or SINGLE PANEL PRICE | The price for one unit of the delivery format chosen in the calculator. |
| SOLDERMASK (SM) | A protective layer of liquid photo image able lacquer applied on the TOP and BOTTOM side of a Printed Circuit Board. |
| SPECIFIC TOLERANCES | Tolerances that are required to meet specific design goals and are not within the latest Industrial Standard IPC A-600 (x) Class II. |
| SPECIFIC MARKINGS | Customer specific markings such as logo, name, date code etc… |
| STENCIL | Stainless Steel template for applying Solder paste onto the board. |
| THROUGH HOLE | A hole that goes through the PCB from the Top Layer through to the Bottom Layer. |
| Tg | Tg stands for Glass Transition Temperature and is one of the parameters of a base materials. |
| TOTAL PRICE | The price for all selected items. |
| TOP | Top side of the PCB. |
| TT | The Track to Track spacing specified in mm |
| TP | The Track to Pad spacing is specified in mm |
| UL MARKING | The Underwriters Laboratory (UL) |
| TW | The Track Width is specified in mm |
| VIA HOLES | A hole that creates an electrically connected through the PCB. |
| WARP and TWIST | WARP and TWIST |
| VIA FILLING | The filling of Via Holes with Resin |
