JHDPCB Manufacturing Capacity

Category Capability Mass batch Small Batch Sample Order
Category Capability Mass batch Small Batch Sample Order
Base Material Normal FR-4 Tg Value Shengyi S1141, KB6160, Huazhen H140(not suitable for lead free process )
Middle FR-4 Tg Value For HDI, multi layers: SY S1000H, ITEQIT158, HuazhengH150, TU-662,
High FR-4 Tg Value For thick copper, high layer: SY S1000-2, ITEQIT180A, HuazhengH170, ISOLA: FR408R, 370HR, TU-752,
Halogen Free Middle Tg:SY S1150G, HuazhengH150HF, H160HF. High Tg:SY S1165
High CTI CTI≥600V SY S1600, Huazheng H1600HF, H1600A,
High Frequency Rogers, Arlon, Taconic, SY SCGA-500, S7136, HuazhengH5000
High Speed SY S7439, TU-862HF, TU-872SLK, ISOLA: I-Speed, I-Tera@MT40, Huazheng: H175, H180, H380
Flex Material Base: Glue-free: Dupont AK XingyangW-type, Panosonic RF-775,
Coverlay: SY SF305C, Xingyang Q-type
Special PP No flow PP: VT-447LF, Taiguang 370BL, Arlon 49N
Ceramic filled adhesive sheet:Rogers4450F
PTFE adhesive sheet:Arlon6700, Taconic FR-27/FR-28
Double-sided coatingPI: xingyang N-1010TF-mb
Metal Base Berguist Al-base, Huazheng Al-base, chaosun Al-base, copperbase
Special High heat resistance rigidity PI: Tenghui VT-901, Arlon 85N, SY S260(Tg250) High thermal conductivity material: 92ML Pure ceramic material: alumina ceramic, Aluminum nitride ceramics BT material: Taiwan Nanya NGP-200WT
Layers FR4 14 14 20
HDI 2 steps 3 steps 4 steps
Delivery Size (mm) Max Size (mm) 544*620 544*620 544*900
Min Size (mm) 20*20 10*10 5*10
Width / Gap Inner(mil) 0.5OZ base copper:3/3 1.0OZ base copper:4/4 2.0OZ base copper:5/6
3.0OZ base copper:7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15
Outer(mil) 1/3OZ base copper:3/3 0.5OZ base copper:4/4 1.0OZ base copper:5/5
2.0OZ base copper:6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13
Line Width Tolerance >5.0 mil ±20% ±20% ±1.0mil
≤5.0 mil ±1.0mil ±1.0mil ±1.0mil
Copper Thickness Inner layer(OZ) 2 6 8
Out layer(OZ) 2 5 6
Board thickness(mm) 0.5-5.0 0.4-6.5 0.4-11.5
Final Board Thickness >1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
Board thickness/drill bit 10:01:00 12:01:00 13:01:00
Contour Bevel edge 20-60 degree, ±5degree 20-60 degree, ±5degree 20-60 degree, ±5degree
Bow and twist ≤0.75% ≤0.75% ≤0.5%
Category Capability Mass batch Small Batch Sample Order
Drilling Min laser (mm) 0.1 0.1 0.1
Min CNC(mm) 0.2 0.15 0.15
Max CNC drill bit(mm) 6.5 6.5 6.5
Min Half Hole(mm) 0.5 0.4 0.4
PTH Hole Normall (mm) ±0.1 ±0.075 ±0.075
PTH Hole Pressing Hole(mm) ±0.05 ±0.05 ±0.05
Hole Angle (conical) Width of upper diameter≤6.5mm:800、900、1000、1100; Width of upper diameter≥6.5mm:900;
Precision of Depth-control Drilling(mm) ±0.10 ±0.075 ±0.05
Number of blind CNC holes of one side ≤2 ≤3 ≤4
Minimum via hole spacing (different network, military, medical, automobile )mm 0.5 0.45 0.4
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm 0.4 0.35 0.3
The minimum hole wall spacing of the over hole (the same network mm) 0.2 0.2 0.15
Minimum hole wall spacing (mm) for device holes 0.8 0.7 0.7
The minimum distance from via hole to the inner copper or line 0.2 0.18 ≤10L: 0.15
>10L: 0.18
The min distance from Device hole to inner copper or line 0.3 0.27 0.25
Welding Ring(mil) Via hole 4(HDI 3mil) 3.5(HDI 3mil) 3
Component hole 8 6 6
Final Board Thickness >1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
CNC contour tolerance(mm) ±0.15 ±0.10 ±0.10
V-CUT Tolerance of residual thickness(mm) ±0.15 ±0.10 ±0.10
Routing slot(mm) ±0.15 ±0.10 ±0.10
Precision of controlled deep milling(mm) ±0.15 ±0.10 ±0.10
Category Capability Mass batch Small Batch Sample Order
Solder Dam (mil) (solder mask) 5 4 4
(hybrid) 6 5 5
Category Capability Mass batch Small Batch Sample Order
Immersion gold Ni thickness (micro inch) 118-236 118-236 118-236
Max gold (uinch) 3 3 6
Hard gold(Au thick) Gold finger (uinch) 15 30 60
NiPdAu NI (uinch) 118-236
PA (uinch) 2-5
Au (uinch) 1-5
Graph electric gold NI (uinch) 120-400
AU (uinch) 1-3
Immersion tin Tin (um) 0.8-1.2
Immersion Ag Ag (uinch) 6-10
OSP thick (um) 0.2-0.5
HAL/HAL LF BGApad(mm) ≥0.3×0.3
thickness (mm) 0.6≤H≤3.0
Board thickness vs hole diameter Press hole≤3:1
Tin(um) 2.0-40.0
Category Capability Mass batch Small Batch Sample Order
Special Technique Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination Buried magnetic core PCB Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB