JHDPCB Manufacturing Capacity
Specifications
| Category | Capability | Mass batch | Small Batch | Sample Order |
|---|---|---|---|---|
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Base Material | Normal FR-4 Tg Value | Shengyi S1141, KB6160, Huazhen H140（not suitable for lead free process ） | ||
| Middle FR-4 Tg Value | For HDI, multi layers: SY S1000H, ITEQIT158, HuazhengH150, TU-662, | |||
| High FR-4 Tg Value | For thick copper, high layer: SY S1000-2, ITEQIT180A, HuazhengH170, ISOLA: FR408R, 370HR, TU-752, | |||
| Halogen Free | Middle Tg:SY S1150G, HuazhengH150HF, H160HF. High Tg:SY S1165 | |||
| High CTI | CTI≥600V SY S1600, Huazheng H1600HF, H1600A, | |||
| High Frequency | Rogers, Arlon, Taconic, SY SCGA-500, S7136, HuazhengH5000 | |||
| High Speed | SY S7439, TU-862HF, TU-872SLK, ISOLA: I-Speed, I-Tera@MT40, Huazheng: H175, H180, H380 | |||
| Flex Material | Base: Glue-free: Dupont AK XingyangW-type, Panosonic RF-775, | |||
| Coverlay: SY SF305C, Xingyang Q-type | ||||
| Special PP | No flow PP: VT-447LF, Taiguang 370BL, Arlon 49N | |||
| Ceramic filled adhesive sheet:Rogers4450F | ||||
| PTFE adhesive sheet:Arlon6700, Taconic FR-27/FR-28 | ||||
| Double-sided coatingPI: xingyang N-1010TF-mb | ||||
| Metal Base | Berguist Al-base, Huazheng Al-base, chaosun Al-base, copperbase | |||
| Special | High heat resistance rigidity PI: Tenghui VT-901, Arlon 85N, SY S260（Tg250） High thermal conductivity material: 92ML Pure ceramic material: alumina ceramic, Aluminum nitride ceramics BT material: Taiwan Nanya NGP-200WT | |||
| Layers | FR4 | 14 | 14 | 20 |
| HDI | 2 steps | 3 steps | 4 steps | |
| Delivery Size (mm) | Max Size (mm) | 544*620 | 544*620 | 544*900 |
| Min Size (mm) | 20*20 | 10*10 | 5*10 | |
| Width / Gap | Inner（mil） | 0.5OZ base copper:3/3 | 1.0OZ base copper:4/4 | 2.0OZ base copper:5/6 |
| 3.0OZ base copper:7/9 | 4.0OZ base copper: 8/12 | 5.0OZ base copper: 10/15 | ||
| Outer（mil） | 1/3OZ base copper:3/3 | 0.5OZ base copper:4/4 | 1.0OZ base copper:5/5 | |
| 2.0OZ base copper:6/8 | 3.0OZ base copper: 7/10 | 4.0OZ base copper: 8/13 | ||
| Line Width Tolerance | ＞5.0 mil | ±20% | ±20% | ±1.0mil |
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |
| Copper Thickness | Inner layer（OZ） | 2 | 6 | 8 |
| Out layer（OZ） | 2 | 5 | 6 | |
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |
| Board thickness/drill bit | 10:01:00 | 12:01:00 | 13:01:00 | |
| Contour | Bevel edge | 20-60 degree, ±5degree | 20-60 degree, ±5degree | 20-60 degree, ±5degree |
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% |
Drilling & Hole
| Category | Capability | Mass batch | Small Batch | Sample Order |
|---|---|---|---|---|
| Drilling | Min laser （mm） | 0.1 | 0.1 | 0.1 |
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | |
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | |
| Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |
| PTH Hole Normall (mm) | ±0.1 | ±0.075 | ±0.075 | |
| PTH Hole Pressing Hole(mm) | ±0.05 | ±0.05 | ±0.05 | |
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100； Width of upper diameter≥6.5mm：900； | |||
| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | |
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.5 | 0.45 | 0.4 | |
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |
| The minimum hole wall spacing of the over hole (the same network mm) | 0.2 | 0.2 | 0.15 | |
| Minimum hole wall spacing (mm) for device holes | 0.8 | 0.7 | 0.7 | |
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 | |
| >10L: 0.18 | ||||
| The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |
| Welding Ring(mil) | Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 |
| Component hole | 8 | 6 | 6 | |
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 |
| V-CUT Tolerance of residual thickness(mm) | ±0.15 | ±0.10 | ±0.10 | |
| （mm） | ||||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | |
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | |
Solder Mask
| Category | Capability | Mass batch | Small Batch | Sample Order |
|---|---|---|---|---|
| Solder Dam (mil) | （solder mask） | 5 | 4 | 4 |
| （hybrid） | 6 | 5 | 5 |
Surface Treatment
| Category | Capability | Mass batch | Small Batch | Sample Order |
|---|---|---|---|---|
| Immersion gold | Ni thickness (micro inch) | 118-236 | 118-236 | 118-236 |
| Max gold (uinch) | 3 | 3 | 6 | |
| Hard gold(Au thick) | Gold finger (uinch) | 15 | 30 | 60 |
| NiPdAu | NI (uinch) | 118-236 | ||
| PA (uinch) | 2-5 | |||
| Au (uinch) | 1-5 | |||
| Graph electric gold | NI (uinch) | 120-400 | ||
| AU (uinch) | 1-3 | |||
| Immersion tin | Tin (um) | 0.8-1.2 | ||
| Immersion Ag | Ag (uinch) | 6-10 | ||
| OSP | thick (um) | 0.2-0.5 | ||
| HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||
| thickness （mm） | 0.6≤H≤3.0 | |||
| Board thickness vs hole diameter | Press hole≤3:1 | |||
| Tin（um） | 2.0-40.0 |
Special Technique
| Category | Capability | Mass batch | Small Batch | Sample Order |
|---|---|---|---|---|
| Special Technique | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
