PCB testing and standards and certification abbreviations

BST (Boundary Scan Test) is a method for testing integrated circuits on PCBs by detecting and diagnosing faults through scan chains. This method is useful for proving the integrity of the circuit on an electronic physical level and evaluating features, at-speed, and measurement. JTAG boundary scan technology provides access to many logic signals of a complex integrated circuit, including the device pins. The signals are represented in functional testing, which is the last type of test process in the PCOLA/SOQ/FAM defect spectrum. Boundary scan can also be used for in-system programming (ISP) and in-system configuration (ISC) of programmable devices such as FPGAs, CPLDs, and flash memories.

ET (Electrical Test) is a method for testing the electrical performance of PCBs, typically using test fixtures and test equipment. This test method can be used to verify the continuity of electrical connections, measure resistance, capacitance, inductance, and other electrical parameters. ET can also be used to detect short circuits, open circuits, and other faults in the PCB. The test fixtures used in electrical testing are designed to provide a stable and repeatable interface between the PCB and the test equipment.

FT (Functional Test) is a method for testing the functionality of PCB components and systems, typically using automatic test equipment (ATE) or manual test equipment. The purpose of functional testing is to verify that the printed circuit board (PCB) performs its intended operation accurately. This test method can be used to verify the behavior of the PCB under different operating conditions, such as temperature, humidity, and vibration. Functional testing can also be used to verify the performance of the PCB under different loads and stress conditions.

ST (Solderability Test) is a method for testing the quality of solder joints between PCB pads and component pins, typically using temperature and time-controlled testing equipment. The test procedure is employed to confirm the durability and dependability of the solder connections. Solderability testing can be performed before, during, or after the assembly process. It is important to ensure that the solder joints are of high quality to prevent failures due to mechanical stress, thermal stress, and other environmental factors.

ST (Solderability Test) is a method for testing the quality of solder joints between PCB pads and component pins, typically using temperature and time-controlled testing equipment. This particular testing technique is utilized to ensure that the soldered connections are robust and dependable.Solderability testing can be performed before, during, or after the assembly process. It is important to ensure that the solder joints are of high quality to prevent failures due to mechanical stress, thermal stress, and other environmental factors.

AOI (Automated Optical Inspection) is a method for automatically inspecting PCB components and solder joint quality using optical equipment. AOI systems use cameras and image processing algorithms to detect defects such as missing components, misaligned components, and solder joint defects. This test method is fast and accurate, and can be used to inspect large volumes of PCBs quickly. AOI is particularly useful for inspecting PCBs with fine-pitch components and high-density interconnects.

ICT (In-Circuit Test) is a method for testing electronic components on PCBs by injecting test signals into the circuit to detect electrical performance of the components. This method is useful for detecting faults such as open circuits, short circuits, and component value errors. ICT is often used in conjunction with other test methods such as boundary scan and functional testing to provide comprehensive testing coverage for the PCB.

FCT (Functional Circuit Test) is a method for testing the system functionality of PCBs by simulating actual usage conditions to detect system performance. This method is used to verify that the PCB performs its intended function correctly under different operating conditions. FCT is often performed after other test methods such as ICT and AOI to provide a complete picture of the PCB’s performance.

ESD (Electrostatic Discharge Test) is a method for testing the ability of PCB components and systems to withstand electrostatic discharge, typically using ESD testing equipment. This test method is used to verify that the PCB can withstand electrostatic discharge events that can occur during handling, assembly, and use. ESD testing is particularly important for PCBs used in sensitive applications such as aerospace, medical, and military.

HTT (High Temperature Test) is a method for testing the performance and reliability of PCB systems in high temperature environments, typically using high temperature testing equipment. This test method is used to verify that the PCB can operate reliably at high temperatures without degrading or failing. High-temperature testing (HTT) holds significant importance for printed circuit boards (PCBs) that are implemented in high-temperature settings like industrial, aerospace, and automotive sectors.

LTT (Low Temperature Test) is a method for testing the performance and reliability of PCB systems in low temperature environments, typically using low temperature testing equipment. This test method is used to verify that the PCB can operate reliably at low temperatures without degrading or failing. LTT is particularly important for PCBs used in low temperature applications such as aerospace, scientific research, and industrial.

RT (Reliability Test) is a method for testing the reliability and stability of PCB systems under different conditions, typically using environmental testing equipment and accelerated life testing equipment. This test method is used to verify that the PCB can withstand environmental factors such as temperature, humidity, and vibration, and that it can operate reliably over its expected lifetime. RT is often used in conjunction with other test methods such as HTT and LTT to provide a complete picture of the PCB’s performance under different conditions.

VT (Vibration Test) is a method for testing the performance and reliability of PCB systems in vibration environments, typically using vibration testing equipment. This test method is used to verify that the PCB can withstand vibration events that can occur during transportation, operation, and other activities. Vibration testing (VT) holds significant importance for printed circuit boards (PCBs) that are implemented in applications like industrial, aerospace, and automotive sectors.

ST (Shock Test) is a method for testing the performance and reliability of PCB systems in shock environments, typically using shock testing equipment. This test method is used to verify that the PCB can withstand shock events that can occur during transportation, handling, and other activities. ST is particularly important for PCBs used in applications such as military, aerospace, and industrial.

TCT (Thermal Cycling Test) is a method for testing the performance and reliability of PCB systems under temperature change environments, typically using thermal cycling testing equipment. This test method is used to verify that the PCB can withstand temperature cycling events that can occur during operation and environmental changes. TCT is particularly important for PCBs used in applications such as automotive, aerospace, and industrial.

EOT (Environmental Test) is a method for testing the performance and reliability of PCB systems under different environmental conditions, including temperature, humidity, pressure, and climate. This test method is used to verify that the PCB can operate reliably under a wide range of environmental conditions. EOT is particularly important for PCBs used in applications such as aerospace, military, and industrial.

ALT (Accelerated Life Test) is a method for testing the performance and reliability of PCB systems under simulated long-term usage conditions in a short period, typically using accelerated life testing equipment. This test method is used to verify that the PCB can operate reliably over its expected lifetime without degrading or failing. ALT is particularly important for PCBs used in applications such as medical devices, aerospace, and industrial.

LT (Linearity Test) is a method for testing the linearity and accuracy of sensors used in PCB systems, typically using linearity testing equipment. This test method is used to verify that the sensors can accurately measure and report data over their full range of operation. LT is particularly important for PCBs used in applications such as medical devices, automotive, and scientific research.

AT (Analog Test) is a method for testing analog circuits in PCB systems, typically using signal generators and oscilloscopes. This test method is used to verify the performance and accuracy of analog circuits such as amplifiers, filters, and oscillators. AT is particularly important for PCBs used in applications such as audio equipment, medical devices, and scientific research.

AXI (Automated X-ray Inspection) is a method for inspecting the quality of solder joints and internal components in PCBs using X-rays and detection equipment. AXI is similar to XI but is automated and can provide faster and more accurate inspection results. AXI is particularly useful for inspecting complex PCBs with high-density components or hidden solder joints. Automated X-ray inspection (AXI) is capable of validating the positioning and alignment of electronic components on the printed circuit board (PCB).