BGA package

The working principle of the single chamber spray system is the same as that of the bowl machine. All processing steps will be performed in the same processing room. The machine can spray the cleaning medium onto the electronic components for cleaning through the nozzle assembly or rotating the spray arm. The cleaning effect is usually achieved not by the ejection pressure but by the volume of the cleaning medium of the substrate.
This type of machine is suitable for small and medium-sized production speeds, and it takes up less space in the production area.

In the immersion tank cleaning system, components, templates, pads, machine parts and so on usually need to go through several cleaning stages, in which separate cleaning, rinsing and drying steps are required. Compared with the single chamber spray system, the agitation of cleaning medium in the immersion tank cleaning system is realized by ultrasonic wave or immersion spray system.
In addition to our commonly used water-based cleaners, another type of flux that can be used in immersion cleaning systems is modern solvent based cleaners with high flash points. When the cleaning materials are transferred from one process step to the next, the part throughput determines whether to use manual or automatic.

It is well known that the propagation of pressure and density fluctuations (compression and sparsity of molecules) in elastic media forms sound. The frequency from 20 Hz to 20 kHz is the range that humans can hear. The vibration that exceeds the maximum frequency that humans can hear is usually called ultrasound.
The frequency range 35 kHz to 45 kHz is a typical cleaning frequency range.In the cleaning tank, the ultrasonic transducer elements in the cleaning tank propagate underinflation and overpressure waves. In order to remove the dirt particles on the surface, cavitation generates pressure jets (micro jets) to achieve this purpose.
Because the acoustic wave can reach every angle where the circuit board is installed, ultrasonic cleaning is useful both under cleaning components and in complex geometries.In order to prevent “hot spots” from cleaning materials, most cleaning machines have an automatic frequency adjustment function, which is used to modulate the working frequency of ultrasound (scanning).
According to mil-std-2000 Rev. A and j-std-001, we can test that the use of ultrasound in electronic cleaning is allowed. However, we carry out the test procedure before applying ultrasonic wave to electronic components.

If a shorter process, drying time and anhydrous cleaning is required, a modern HFE cosolvent cleaning process can be selected. We usually use it in the military and aerospace fields.
HFE (hydrofluoroether) is nonflammable, non-conductive, fast drying and residue free, and is developed as a substitute for CFC or similar solvents.
HFE is used in the cleaning bath together with the cosolvent, and immersion spray or ultrasonic stirring is used to dissolve the persistent residue. The flushing step is only carried out in the HFE bath, followed by steam flushing. Finally, in order to dry PCBs, we need to use strong cooling. In order to prevent HFE evaporation, the process must be carried out in a washing machine with efficient cooling technology.

One chamber vacuum cleaning is only applicable to solvent. When drying in a vacuum environment, the cleaner is sprayed on the components, which is similar to the spraying process in air, thus greatly reducing the process time.
Most solvents have a longer bath life and can achieve shorter processing times due to their effective drying characteristics. For this process, the cleaning machine must be explosion-proof.

In addition to the aforementioned cleaning methods, we can also manually remove flux residues, particles, SMT adhesives and solder pastes.
If throughput is low, manual cleaning is usually a popular option, such as during building prototyping, or during PCBs or electronic component rework or maintenance. No investment in equipment is required for immediate manual cleaning. The first choice for automated cleaning processes is that production facilities with medium/high throughput and multiple shifts need excellent cleaning effects.As a professional Chinese smt bga assembly supplier, JHD has carried out strict training for production line staff. The degree of cleaning can be well controlled during manual cleaning of small batches of bga assembly.

Inline systems are a cost-effective and time-saving solution for cleaning electronic components for large production and minimal component diversity. The PCB automatically runs each process step on the conveyor belt. In separate chambers, we usually clean, rinse and dry.
When we decide on the inline process, we prioritize footprints. Compared with the batch cleaning machine, this machine needs more floor space. We can integrate this system into the production line and put it into use after the entry and exit of components and the cleaning itself are completely automated.

Because the desired process is confined to one chamber, the system occupies a small area. It includes cleaning, rinsing and drying. The system is determined by the direction of the force acting on the pollutant to be removed, which makes the product rotate in the center of the treatment room to remove the pollutant calmly.
We will dissolve the particles on the surface of the product by immersing the product in the cleaning solution, and then use gravity to wash away the stubborn stains from the interception space by rotating. In order to avoid any redeposition, we usually distribute the rinsing solution (usually deionized water) to the spinning product after soaking and drain it immediately. After the continuous rotation of the product is completed, the drying cycle simultaneously introduces the filtered hot air into the process room.